Zobacz książki o podobnej tematyce

Powiadomienie o dostępności

Więcej informacji o Electronic Packaging Materials Science IX: Volume 445

• Dane szczegółowe
• Opis
• Ulubione w innej kategorii

Za ten zakup dostaniesz 70 punkty

Opis

While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.

Szczegóły książki

Kategoria Książki po angielsku Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Pełny tytuł: Electronic Packaging Materials Science IX: Volume 445
• Autor: S. K. GroothuisP. S. HoK. IshidaT. Wu
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 322
• EAN: 9781558993495
• ISBN: 1558993495
• ID: 02060103
• Wydawca: Materials Research Society
• Waga: 614 g
• Wymiary: 234 × 157 × 23 mm
• Data wydania: 20. October 1997

---

---

---