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Adhesion Aspects of Polymeric Coatings
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This volume chronicles the proceedings of the Symposium on Adhesion Aspects of Polymeric Coatings held under the auspices of the Electrochemical Society in Minneapolis, MN, May 10-15, 1981. This event was cosponsored by the Dielectric and Insulation, and Electrothermics and Metallurgy Divisions. Polymeric coatings are used for a number of purposes, e. g. , decorative, protective, functional (as dielectrics or insulators) and a special application of polymeric (organic) coatings is their use as lithographic materials for making integrated circuit elements. Irrespective of the purpose of the coating, it must adhere well to the underlying substrate. So the need to under stand the factors which influence adhesion of organic coatings and the ways to attain desired adhesion is quite manifest. This Symposium was designed to bring together scientists and technologists interested in the adhesion aspects of polymeric coatings, to provide a forum for discussion of latest findings, and to provide an opportunity for cross-pollination of ideas. The technical program contained a total of 46 papers by authors from various corners of the world. The program comprised both invited overviews and contributed original research papers, as this blend is the best way to present the state of knowledge of a topic. The invited speakers were selected so as to represent widely differ ing disciplines and interests and they hailed from various aca demic and industrial research laboratories.
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