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Opis

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. §This book also:§Offers broad-ranging chapters with a focus on IC-package-system integrationProvides viewpoints from leading industry executives and expertsDetails state-of-the-art achievements in process technologies and scientific researchPresents a clear development history and touches on trends in the industry while also discussing up-to-date technology informationAdvanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

Szczegóły książki

Kategoria Książki po angielsku Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Pełny tytuł: Advanced Flip Chip Packaging
• Autor: Ho-Ming Tong
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 560
• EAN: 9781441957672
• ISBN: 1441957677
• ID: 01343794
• Wydawca: Springer-Verlag New York Inc.
• Waga: 922 g
• Wymiary: 243 × 162 × 26 mm
• Data wydania: 21. March 2013

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