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Więcej informacji o Chemical-Mechanical Planarization: Volume 767

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Opis

Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.

Szczegóły książki

Kategoria Książki po angielsku Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Pełny tytuł: Chemical-Mechanical Planarization: Volume 767
• Autor: Duane S. BoningKatia DevriendtMichael R. OliverDavid J. Stein
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 348
• EAN: 9781558997042
• ISBN: 1558997040
• ID: 02060357
• Wydawca: Materials Research Society
• Waga: 591 g
• Wymiary: 234 × 157 × 23 mm
• Data wydania: 27. August 2003

Ulubione w innej kategorii

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